New materials, printed circuit boards, assembly technologies and electronic applications are developed and then implemented by electronic companies. They include, for example, special printed circuit boards with embedded components, environmentally-friendly materials and technologies for the assembly of electronic components, nanomaterials for sensors, pastes and inks for manufacturing printed electronics and printing technologies for printed electronics. Furthermore, the Research Centre for Electronic Technology performs research for companies in the development of new solutions for printed circuit boards, validation of process materials, sub-assemblies, products and processes, assembly of electronic units and research related to troubleshooting technical issues encountered during the installation and soldering of electronic equipment.
Examination of electronic systems
The Department for Integrated Electronic Technologies tests components for assembly and disassembly of electronic units, works out new applications integrating various technologies and carries out tests on the validation of electronic assemblies and products.
The work in progress includes the development of new assembly solutions and bases as well as materials and technologies for connecting electronic components into assemblies. The processes and phenomena occurring during the assembly of electronic units, which affect their quality and reliability, are scrutinised. Research areas also include RFID, printed, flexible and organic electronics technologies, issues related to thermal management of electronic devices and the reliability of units for special and space purposes. The department also examines and solves non-standard technical problems occurring in assembly facilities for electronic products and investigates the possibilities of using electronic products in various industries.
Some tests are performed by the Laboratory for Quality Testing and Calibration of Electronic Products (accreditation No AB045), which carries out accredited quality tests of printed circuit boards and electronic components, climatic tests and reliability tests of electronic circuits as well as IPC, X-ray, SEM, quality and reliability analyses for soldered joints.
The research activities of the Department for Electronic Assembly Technologies are focused on the practical demands of electronic product manufacturers from different industries.
Since 1999, the Department has been performing research on the implementation of SMT, THT and THR lead-free assembly into subsequent group of products, subject to RoHS regulations. Assembly technologies are tested using a series of soldering materials, such as pastes, fluxing agents and alloys, which address the need for increased connection density on different printed circuit boards. Furthermore, the department focuses on assembly technologies for miscellaneous electronic components, including miniature components, CSPs, open flip chip semiconductor units and R/C components with sizes up to 0201. Assembly technologies for 3D structures based on PoP and TMV PoP systems and assembly technologies for electronic units for special and space purposes have also been recently tested.
The Department for Printed Circuit Board Technology creates printed circuit boards for civil and military applications. It manufactures single-sided, two-sided, multilayer, flexible, rigid and flexible, aluminium and Teflon printed circuit boards. The structure of the boards may be symmetrical, asymmetrical or hybrid. The following ranges of technical parameters apply:
In cooperation with numerous research centres, we have been implementing research projects dedicated to wireless sea and space communication technology. Tests are conducted on antenna technologies (development of 2.5D and other special structures), detection of defects in printed circuits (e.g. CAF, Black Pads) and repair of PCB failures.